Capacitor for use in an integrated circuit

ABSTRACT

A capacitor including a first plate of conductive material that is formed in a predetermined shape. A layer of dielectric material is formed on at least a portion of the first plate and substantially conforms to the predetermined shape of the first plate. A second plate of conductive material is formed over the layer of dielectric material.

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] The present application is related to U.S. patent applicationSer. No. 09/838,526, filed Mar. 19, 2001, entitled “Capacitor for Use inIntegrated Circuits,” by R. Jacob Baker et al. and assigned to the sameassignee as the present invention.

FIELD OF THE INVENTION

[0002] The present invention relates generally to semiconductorintegrated circuits, and more particularly to a capacitor and capacitorarray for use in integrated circuits, such as memory systems and thelike.

BACKGROUND OF THE INVENTION

[0003] There is a continuing demand for electronic systems to performmore functions or operations in shorter periods of time. This typicallyrequires additional components to perform the additional functions andto store more programs and data. At the same time packaging requirementsare decreasing in size. Consumers want smaller, lighter weight productsthat do more and are more mobile or portable. Accordingly, circuitdesigners are challenged to provide more components and greater capacityper unit of area on a semiconductor die.

[0004] Most electronic circuits include basic electrical components suchas transistors, resistors, inductors, capacitors and the like.Capacitors are one component that can occupy considerable area on asemiconductor die depending upon the size of the capacitor or the numberof capacitors. For example, a memory system or device can include alarge number of capacitors for storing information. Capacitors aretypically made by depositing a first metal plate, depositing a layer ofdielectric material over the first metal plate and then depositing asecond metal plate over the layer of dielectric material andsubstantially parallel to the first metal plate. The size of thecapacitance will be a function of the surface area of the two facingparallel plates and other parameters such as the dielectric constant ofthe dielectric material and the spacing between the plates. Accordingly,one primary means of increasing the capacitance, is to increase the sizeof each of the parallel plates but this will also consume more area onthe semiconductor die.

[0005] As previously mentioned, some electronic circuits, such as memorydevices or systems use capacitors to store data electronically. Forexample, a capacitor with a charge on it can represent a logic 1 and anuncharged capacitor can represent a logic 0. Accordingly, as electronicsystems or computer systems are required to perform more functions andto store more programs and data, memory devices and systems will requiremore memory cells with each cell including a capacitor to store theinformation. Memory device and system designers are therefore challengedto provide more storage capacity while using a minimum amount of area ona semiconductor die. For efficiency and speed of operation, the storedinformation is also preferably located close to those components thataccess and use the information. Accordingly, memory devices or systemsare often formed on the same chip or semiconductor die with othercomponents and it becomes important in the manufacturing process thatthe operations to make the different components are compatible and donot adversely effect one another and that the different components canbe manufactured efficiently with the lowest possible cost and time.

[0006] Accordingly, for the reason stated above, and for other reasonsthat will become apparent upon reading and understanding the presentspecification, there is a need for a capacitor or an array of capacitorsthat maximizes the amount of capacitance and number of capacitors perunit of area of a semiconductor die or chip. There is also a need for acapacitor or capacitor array that can be manufactured efficiently withminimal process operations and with process operations that arecompatible with or do not interfere with other circuitry or componentsformed on the same semiconductor die.

SUMMARY OF THE INVENTION

[0007] In accordance with the present invention, a capacitor includes afirst plate of conductive material formed in a predetermined shape. Alayer of dielectric material is formed on at least a portion of thefirst plate and substantially conforms to the predetermined shape of thefirst plate. A second plate is formed over the layer of dielectricmaterial.

[0008] In accordance with an embodiment of the present invention, acapacitor includes a layer of forming material and a nucleation layerformed on the layer of forming material. A substantially cone-shapedfirst plate of conductive material includes a vertex portion extendingthrough the nucleation layer and partially into the layer of formingmaterial. At least one of an interior surface and an exposed exteriorsurface of the first plate extending from the layer of forming materialand the nucleation layer can be converted to hemispherical grains. Alayer of dielectric material is formed on the nucleation layer and onthe interior surface and the exposed exterior surface of the firstplate. The dielectric layer substantially conforms to the shape of thefirst plate and the hemispherical grains. A second plate of conductivematerial is formed over the dielectric layer.

[0009] In accordance with an embodiment of the present invention, anarray of capacitors includes a plurality of first plates of conductivematerial. Each first plate is formed in a predetermined shape with anopen or hollow interior portion. A layer of dielectric material isformed on the plurality of first plates and substantially conforms tothe shape of each of the first plates. A second plate of conductivematerial is formed over the layer of dielectric material.

[0010] In accordance with an embodiment of the present invention, amemory system includes an array of memory elements and each memoryelement includes a capacitor. Each capacitor comprises a first plate ofconductive material formed in a predetermined shape. A layer ofdielectric material is formed on at least a portion of the first plateand substantially conforms to the shape of the first plate. A secondplate of conductive material is formed over the layer of dielectricmaterial.

[0011] In accordance with the present invention, a semiconductor dieincludes a substrate and an integrated circuit formed on or supported bythe substrate. The integrated circuit includes at least one capacitor.The capacitor includes a first plate of conductive material formed in apredetermined shape and a layer of dielectric material formed on atleast a portion of the first plate and substantially conforming to theshape of the first plate. A second plate of conductive material isformed over the layer of dielectric material.

[0012] In accordance with the present invention, an electronic systemincludes a processor and a memory system coupled to the processor. Thememory system comprises an array of memory elements and each memoryelement includes a capacitor. Each capacitor includes a first plate ofconductive material formed in a predetermined shape. A layer ofdielectric material is formed on at least a portion of the first plateand substantially conforms to the shape of the first plate. A secondplate of conductive material is formed over the layer of dielectricmaterial.

[0013] In accordance with the present invention, a method of making acapacitor includes: forming a substantially cone-shaped first plate ofconductive material; forming a layer of dielectric material on at leasta portion of the first plate and substantially conforming to the shapeof the first plate; and forming a second plate of conductive materialover the layer of dielectric material.

[0014] In accordance with the present invention, a method of making amemory system includes: forming an array of memory elements; and forminga capacitor associated with each memory element. Forming each capacitorincludes: forming a first plate of conductive material formed in apredetermined shape, forming a layer of dielectric material formed on atleast a portion of the first plate and substantially conforming to theshape of the first plate, and forming a second plate of conductivematerial formed over the layer of dielectric material.

[0015] In accordance with the present invention, a method of making asemiconductor die includes: providing a substrate; forming an integratedcircuit supported by the substrate; and forming a capacitor associatedwith the integrated circuit. Forming the capacitor includes: forming afirst plate of conductive material formed in a predetermined shape,forming a layer of dielectric material formed on at least a portion ofthe first plate and substantially conforming to the shape of the firstplate, and forming a second plate of conductive material formed over thelayer of dielectric material.

[0016] In accordance with the present invention, a method of making anelectronic system includes: forming a processor; and forming a memorysystem coupled to the processor. The memory system includes a pluralityof memory cells and each memory cell includes a capacitor. Forming eachcapacitor includes: forming a first plate of conductive material formedin a predetermined shape, forming a layer of dielectric material formedon at least a portion of the first plate and substantially conforming tothe shape of the first plate, and forming a second plate of conductivematerial formed over the layer of dielectric material.

[0017] These and other embodiments, aspects, advantages and features ofthe present invention will be set forth in part in the description whichfollows, and in part will become apparent to those skilled in the art byreference to the following description of the invention and referenceddrawings or by practice of the invention. The aspects, advantages, andfeatures of the invention are realized and attained by means of theinstrumentalities, procedures, and combinations particularly pointed outin the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In the drawings, like numerals describe substantially similarcomponents throughout the several views. Like numerals having differentletter suffixes or primed (X′) represent different occurrences ofsubstantially similar components.

[0019] FIGS. 1A-1H illustrate the operations in forming a capacitor oran array of capacitors in accordance with the present invention.

[0020]FIG. 2 is a top elevation view of a plurality of cavities formedin a substrate to form a capacitor array in accordance with the presentinvention.

[0021] FIGS. 3A-3C illustrate the operations in forming a capacitor orarray of capacitors in accordance with an embodiment of the presentinvention.

[0022] FIGS. 4A-4C illustrate the operations in forming a capacitor orarray of capacitors in accordance with another embodiment of the presentinvention.

[0023]FIG. 5 is a block schematic diagram of a semiconductor die or chipincluding an integrated circuit and capacitor array in accordance withthe present invention.

[0024]FIG. 6 is a schematic diagram of a memory device or systemincluding capacitors in accordance with the present invention.

[0025]FIG. 7 is a top view of a wafer or substrate containingsemiconductor dies in accordance with an embodiment of the presentinvention.

[0026]FIG. 8 is a block schematic diagram of a circuit module inaccordance with an embodiment of the present invention.

[0027]FIG. 9 is a block schematic diagram of a memory module inaccordance with an embodiment of the present invention.

[0028]FIG. 10 is a block schematic diagram of an electronic system inaccordance with another embodiment the present invention.

[0029]FIG. 11 is a block schematic diagram of a memory system inaccordance with an embodiment of the present invention.

[0030]FIG. 12 is a block schematic diagram of a computer system inaccordance with an embodiment of the present invention.

DESCRIPTION OF THE EMBODIMENTS

[0031] In the following detailed description of the preferredembodiments, reference is made to the accompanying drawings which form apart hereof, and in which is shown by way of illustration specificembodiments in which the invention may be practiced. These embodimentsare described in sufficient detail to enable those skilled in the art topractice the invention, and it is to be understood that otherembodiments may be utilized and that process or mechanical changes maybe made without departing from the scope of the present invention. Theterms wafer and substrate used in the following description include anybase semiconductor structure. Both are to be understood as includingsilicon-on-sapphire (SOS) technology, silicon-on-insulator (SOI)technology, thin film transistor (TFT) technology, doped and undopedsemiconductors, epitaxial layers of a silicon supported by a basesemiconductor, as well as other semiconductor support structures wellknown to one skilled in the art. Furthermore, when reference is made toa wafer or substrate in the following description, previous processsteps may have been utilized to form regions/junctions in the basesemiconductor structure. The following detailed description is,therefore, not to be taken in a limiting sense, and the scope of thepresent invention is defined only by the appended claims.

[0032] The transistors described herein include transistors frombipolar-junction technology (BJT), field effect technology (FET), orcomplimentary metal-oxide-semiconductor (CMOS). Ametal-oxide-semiconductor (MOS) transistor includes a gate, a first node(drain) and a second node (source). Since a MOS transistor is typicallya symmetrical device, the true designation of “source” and “drain” isonly possible once voltage is impressed on the terminals. Thedesignations of source and drain herein should be interpreted,therefore, in the broadest sense. It should also be noted that aP-channel MOS transistor could alternatively be used for an N-channelMOS transistor and vice versa with the polarity of the associated gatevoltages merely being reversed. For example, applying a negative gatevoltage in the situation of a P-channel MOS transistor to activate thetransistor and reversing the polarity to apply a positive gate voltageto activate an N-channel transistor if an N-channel MOS transistor issubstituted for a P-channel transistor.

[0033] FIGS. 1A-1H illustrate the operations in forming a capacitor oran array of capacitors 100 in accordance with the present invention. InFIG. 1A, a first layer 102 of forming material is deposited or formed.The first layer 102 of forming material can be a doped oxide or thelike. A plurality of electrodes 104 can be formed in the first layer 102of forming material by conventional photolithographic techniques. Theelectrodes 104 can have a selected pitch or spacing S between them. Theelectrodes 104 can be made of a metal or semiconductive material. Anucleation layer 106 can be formed on the first layer 102. Thenucleation layer 106 can be formed from an undoped oxide or the like. Asecond layer 108 of forming material can be formed on the nucleationlayer 106. The second layer 108 of forming material can also be a layerof doped oxide or the like. The nucleation layer 106 can be much thinnerthan the first layer 102 of forming material and the second layer 108 offorming material can be much thicker than the first layer 102.

[0034] In FIG. 1B, a plurality of openings or cavities 110 are formed ina surface 112 of the second layer 108 of forming material and inalignment with each of the electrodes 104. The cavities 110 are formeddown through the second layer 108, the nucleation layer 106 andpartially through the first layer 102 of forming material to expose atop portion 114 of each of the electrodes 104. The electrodes 104 serveas an etch stop to define the bottom of each of the cavities 110. Thecavities 110 are formed to have a predetermined shape by standardphotolithographic techniques and can have a depth dimension D muchlarger than a diameter or width dimension W. The predetermined shape ofthe cavities 110 can be substantially cone-shaped and can have asubstantially elliptical or circular cross-section as shown in FIG. 2.

[0035] In FIG. 1C a first plate layer 116 of conductive material isdeposited or formed on the surface of the second layer 112 of formingmaterial and in each of the cavities 110. The first plate layer 116 canhave a thickness of about 300 angstroms. The first plate layer 116 formsa predetermined shape corresponding to or conforming to thepredetermined shape of each of the cavities 110 and the first platelayer 116 forms open or hollow interior portions or surfaces 118. Thefirst plate layer 116 can be formed from a conductive metal, polysiliconor a semiconductor material.

[0036] Referring to FIG. 1D and also to FIG. 2, an isolation wall 120can be formed around the capacitor array 100. The isolation wall 120prevents the etchants or other materials used in the process operationsto form the capacitor array 100 from adversely affecting or interferingwith other components or integrated circuits already formed on the chipor die. The isolation wall 120 can be a photo mask or be covered by aphoto mask to prevent or block etchants or other materials fromcontacting the other circuits or components on the chip. The isolationwall 120 defines the capacitor array 110 and is preferably formed overthe cavities 110 proximal to a periphery 122 of the capacitor array 100.

[0037] In FIG. 1E, the first plate layer 116 is selectively removed fromthe surface 112 of the second layer 108 of forming material between thecavities 110 to form a plurality of first plates or first capacitorplates 126. A small segment of each first plate 126 can be removed froma small portion 124 of each of the cavities 110 near the surface 112 ofthe second layer 108. The first plate layer 116 can be selectivelyremoved by dry etching with an etchant that is non-reactive to thesecond layer 108 of forming material.

[0038] In FIG. 1F, the second layer 108 of forming material and thephoto mask covering the isolation wall 120 are removed. The array 100can be exposed to a cleaning process to remove the photo mask of theisolation wall 120. The second layer 108 can be removed by wet etchingwith an etchant that is non-reactive to the conductive material of thefirst plates 126. The first plates 126 can act as a mask in the processof removing the second layer 108 of forming material. The nucleationlayer 106 can act as an etch stop or to at least slow down the etch rateso that it can be stopped at a predetermined depth Y. The first layer102 of forming material is preserved to support the first plates 126. Inan embodiment where a nucleation layer 106 is not used and there is onlya single layer 102 of forming material, the etching process must bestopped so that a sufficient portion of the first layer 102 remains tosupport the first plates 126 during the remainder of the processing.Each of the first plates 126 have a predetermined shape that as shown inthe embodiment of FIG. 1F can be substantially cone-shaped including avertex portion 128 or closed end extending through the nucleation layer(if present) and partially into the first layer 102 of forming material.Each of the first plate members 126 have an interior surface 118 orportion, as previously discussed, and an exposed exterior or outersurface 130 extending from the first layer 102 and the nucleation layer106.

[0039] In FIG. 1G, a layer 132 of dielectric material is formed on thenucleation layer 106 and on the first plates 126. The layer 132 willsubstantially conform to the shape of the first plates 126 and willcover the interior surfaces 118 and exterior surfaces 130 of the firstplates 126 exposed above the nucleation layer 106. The layer 132 can bea nitride, an oxide or a dielectric of any thickness. The undoped oxideof the nucleation layer 106 facilitates the nucleation or formation ofthe dielectric layer 132 on the nucleation layer 106 which permits theformation of a thinner layer of dielectric on the first plates 126.

[0040] In FIG. 1H, a second plate 134 or second capacitor plate ofconductive material can be formed on the dielectric layer 132. Theconductive material of the second plate 134 can be a metal, polysiliconor a semiconductor material. The second plate 134 can be formed in bulkover the dielectric layer 132. After forming the second plate 134, thearray 100 can be masked off and the peripheral areas of the die can becleared back to the original level of material. The process of thepresent invention minimizes the step height H between the surface of theoriginal level of the die and a top surface 138 of the second plate 134,thus creating a more desirable planar process.

[0041] The second plate 134 can be a common connection or groundconnection for the capacitor array 100. Connection to each of theindividual capacitors 136 can be made via the electrodes 104 which canbe brought out to a peripheral edge 202 (FIG. 2) of the capacitor array100 for connection to transistors of a memory cell as discussedhereinbelow or to other components of an integrated circuit.

[0042] Referring to FIG. 3A, in accordance with another embodiment ofthe present invention, after the process operations described withreference to FIGS. 1A-1F are carried out and the first layer 108 offorming material is removed in FIG. 1F, if the first plates 126 areformed from polysilicon, the interior surfaces 118 of each of the firstplates 126 can be converted to hemispherical grains (HSG) 302 by astandard technique. Converting to HSG 302 increases the capacitive areaof each of the first plates 126 and thereby increased the capacitance ofeach of the completed capacitor cells.

[0043] In FIG. 3B, a layer 304 of dielectric material similar to thedielectric layer 132 in FIGS. 1G-1H is formed on the HSG 302 of thefirst plates 126. The HSG 302 can be etched to remove micro fissures inthe HSG 302 to provide a better surface for forming the dielectric layer304 and so that the dielectric layer 304 can be thinner and therebyprovide a higher capacitance. In FIG. 3C, a second conductive plate 306or second capacitor plate similar to the second capacitor plate 134 inFIG. 1H is formed on the dielectric layer 304.

[0044] In accordance with another embodiment of the present inventionshown in FIG. 4A, the interior surface 118 and exposed exterior surface130 of each of the first plates 126 (FIG. 1F), if formed frompolysilicon, can be converted to HSG 402 using a standard technique. TheHSG 402 provide more capacitive surface area to each of the first plates126 and hence added capacitance to each of the completed capacitorcells. In FIG. 4B, a layer 404 of dielectric material is formed on theHSG 402 of the first plates 126. As previously discussed, the HSG 402can have micro fissures and can be etched to provide a smoother, moreuniform surface on which to deposit the dielectric layer 404. In FIG.4C, a second conductive plate 406 or second capacitor plate is formed onthe dielectric layer 404.

[0045]FIG. 5 is a block schematic diagram of a semiconductor die 500 orchip including an integrated circuit 502 and capacitor array 504 formedon a substrate 506 in accordance with the present invention. Thecapacitor array 504 can be the same as the capacitor array 100 discussedwith respect to FIGS. 1A-1H or the capacitor arrays 300 and 400 in FIGS.3A-3C and 4A-4C, respectively. Accordingly, the capacitor array 504 ofthe present invention can be formed on the same semiconductor die 500 orsubstrate 506 as the integrated circuit 502. As previously discussed,the second conductive plate 134 in FIG. 1H (or second conductive plate306 in FIG. 3C and second conductive plate 406 in FIG. 4C) can be acommon electrode for the capacitor array 100 (or capacitor arrays 300and 400 in FIGS. 3A-3C and 4A-4C). Each of the individual capacitors 136in FIG. 1H and individual capacitors 308 and 408 in FIGS. 3C and 4C,respectively can be connected to other components by extending theelectrodes 104 (FIGS. 1H, 3C and 4C) to the peripheral edge 202 (FIG. 2)of the capacitor array 100, 300 or 400.

[0046]FIG. 6 is a schematic diagram of a memory device or system 600 inaccordance with the present invention. The memory system 600 is aexample of a system where a capacitor array similar to the capacitorarray 504 of FIG. 5 can be formed as part of an integrated circuit 502.The memory system 600 includes a plurality of memory elements 602 thatcan be arranged in rows and columns. Each memory cell 602 can include atransistor 604. Each transistor 604 includes a gate electrode 606coupled to an address line 608 for controlling the operation of thememory cell 602, and each transistor 604 includes a first source/drainelectrode 610 coupled to a data line 612 and a second source/drainelectrode 614 coupled to a capacitor 616. The capacitor 616 can besimilar to capacitors 126 (FIG. 1H), 308 (FIG. 3C) or 408 (FIG. 4C) andthe capacitors 616 for each of the memory cells 602 can be formed in aarray similar to arrays 100, 300 and 400.

[0047] With reference to FIG. 7, a semiconductor die 710 can be producedfrom a silicon wafer 700 that can contain an electronic system similarto the electronic system 500 of FIG. 5 and the memory system 600 of FIG.6 including the novel capacitor 136 or capacitor arrays 100, 300 or 400in accordance with the present invention. A die 710 is an individualpattern, typically rectangular, on a substrate that contains circuitryto perform a specific function. A semiconductor wafer 700 will typicallycontain a repeated pattern of such dies 710 containing the samefunctionality. Die 710 can further contain additional circuitry toextend to such complex devices as a monolithic processor with multiplefunctionality. Die 710 is typically packaged in a protective casing (notshown) with leads extending therefrom (not shown) providing access tothe circuitry of the die 710 for unilateral or bilateral communicationand control.

[0048] As shown in FIG. 8, two or more dies 710, including at least oneelectronic system 500 or memory system 600 that incorporates the novelcapacitor 136 or capacitor array 100, 300 or 400 in accordance with thepresent invention, can be combined, with or without a protective casing,into a circuit module 800 to enhance or extend the functionality of anindividual die 710. Circuit module 800 can be a combination of dies 710representing a variety of functions, or a combination of dies 710containing the same functionality. Some examples of a circuit module 800include memory modules, device drivers, power modules, communicationmodems, processor modules and application-specific modules and caninclude multi-layer, multi-chip modules. Circuit module 800 can be asub-component of a variety of electronic systems, such as a clock, atelevision, a cell phone, a personal computer, an automobile, anindustrial control system, an aircraft and others. Circuit module 800will have a variety of leads 810 extending therefrom providingunilateral or bilateral communication and control.

[0049]FIG. 9 shows one embodiment of a circuit module as a memory module900 containing circuitry for the memory system 600 including thecapacitor array 100, 300 or 400 of the present invention. Memory module900 generally depicts a Single In-line Memory Module (SIMM) or DualIn-line Memory Module (DIAM). A SIMM or DIAM can generally be a printedcircuit board (PCB) or other support containing a series of memorydevices. While a SIMM will have a single in-line set of contacts orleads, a DIAM will have a set of leads on each side of the support witheach set representing separate I/O signals. Memory module 900 containsmultiple memory devices 910 contained on support 915, the numberdepending upon the desired bus width and the desire for parity. Memorymodule 900 can contain memory devices 910 on both sides of support 915.Memory module 900 accepts a command signal from an external controller(not shown) on a command link 920 and provides for data input and dataoutput on data links 930. The command link 920 and data links 930 areconnected to leads 940 extending from the support 915. Leads 940 areshown for conceptual purposes and are not limited to the positions shownin FIG. 9.

[0050]FIG. 10 shows an electronic system 1000 containing one or morecircuit modules 800 as described above containing the novel memorysystem 600 and capacitor array 100, 300 or 400 of the present invention.Electronic system 1000 generally contains a user interface 1010. Userinterface 1010 provides a user of the electronic system 1000 with someform of control or observation of the results of the electronic system1000. Some examples of user interface 1010 include the keyboard,pointing device, monitor and printer of a personal computer; the tuningdial, display and speakers of a radio; the ignition switch and gas pedalof an automobile; and the card reader, keypad, display and currencydispenser of an automated teller machine. User interface 1010 canfurther describe access ports provided to electronic system 1000. Accessports are used to connect an electronic system to the more tangible userinterface components previously exemplified. One or more of the circuitmodules 800 can be a processor providing some form of manipulation,control or direction of inputs from or outputs to user interface 1010,or of other information either preprogrammed into, or otherwise providedto, electronic system 1000. As will be apparent from the lists ofexamples previously given, electronic system 1000 will often containcertain mechanical components (not shown) in addition to the circuitmodules 800 and user interface 1010. It will be appreciated that the oneor more circuit modules 800 in electronic system 1000 can be replaced bya single integrated circuit. Furthermore, electronic system 1000 can bea sub-component of a larger electronic system.

[0051]FIG. 11 shows one embodiment of an electronic system as memorysystem 1100. Memory system 1100 contains one or more memory modules 900as described above including the memory system 600 and capacitor 136 orcapacitor array 100, 300 or 400 in accordance with the present inventionand a memory controller 1110. Memory controller 1110 provides andcontrols a bidirectional interface between memory system 1100 and anexternal system bus 1120. Memory system 1100 accepts a command signalfrom the external bus 1120 and relays it to the one or more memorymodules 900 on a command link 1130. Memory system 1100 provides for datainput and data output between the one or more memory modules 900 andexternal system bus 1120 on data links 1140.

[0052]FIG. 12 shows a further embodiment of an electronic system as acomputer system 1200. Computer system 1200 contains a processor 1210 anda memory system 1100 housed in a computer unit 1215. Computer system1200 is but one example of an electronic system containing anotherelectronic system, i.e. memory system 1100, as a sub-component. Computersystem 1200 optionally contains user interface components. Depicted inFIG. 12 are a keyboard 1220, a pointing device 1230, a monitor 1240, aprinter 1250 and a bulk storage device 1260. It will be appreciated thatother components are often associated with computer system 1200 such asmodems, device driver cards, additional storage devices, etc. It willfurther be appreciated that the processor 1210 and memory system 1100 ofcomputer system 1200 can be incorporated on a single integrated circuitsimilar to that discussed with respect to FIG. 5. Such single packageprocessing units reduce the communication time between the processor1210 and the memory system 1100.

CONCLUSION

[0053] The present invention thus provides a capacitor or an array ofcapacitors that maximizes the amount of capacitance and number ofcapacitors per unit of area of a semiconductor die or chip. The presentinvention also provides a capacitor or capacitor array that can bemanufactured efficiently with minimal process operations. Additionally,the capacitor or capacitor array of the present invention can bemanufactured on the same semiconductor die with other components and canbe manufactured using process operations that are compatible with themanufacturing processes of other components and that do not interferewith other circuitry or components formed on the same die or chip.

[0054] Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat any arrangement which is calculated to achieve the same purpose maybe substituted for the specific embodiments shown. This application isintended to cover any adaptations or variations of the presentinvention. Therefore, it is intended that this invention be limited onlyby the claims and the equivalents thereof.

What is claimed is:
 1. A capacitor, comprising: a first plate ofconductive material formed in a predetermined shape; a layer ofdielectric material formed on at least a portion of the first plate andsubstantially conforming to the predetermined shape of the first plate;and a second plate of conductive material formed over the layer ofdielectric material.
 2. The capacitor of claim 1, wherein the conductivematerial of the first plate comprises a metal or a semiconductor.
 3. Thecapacitor of claim 1, wherein the layer of dielectric material comprisesany dielectric.
 4. The capacitor of claim 1, wherein the predeterminedshape of the first conductive layer has a depth larger than a width. 5.The capacitor of claim 1, wherein the open interior portion of the firstlayer has a substantially elliptical cross-section.
 6. The capacitor ofclaim 1, wherein the open interior portion of the first plate has asubstantially circular cross-section.
 7. The capacitor of claim 1,wherein the first plate of conductive material is thicker than the layerof dielectric material.
 8. The capacitor of claim 1, wherein the firstplate of conductive material has a thickness of about 300 angstroms. 9.The capacitor of claim 1, wherein the layer of dielectric material has apredetermined thickness.
 10. A capacitor, comprising: a first plate ofconductive material formed in a predetermined shape with an openinterior portion, wherein at least one of an interior surface and atleast a portion of an exterior surface of the first plate are convertedinto hemispherical grains; a layer of dielectric material formed on atleast a portion of the first plate and substantially conforming to thepredetermined shape of the first plate; and a second plate of conductivematerial formed over the layer of dielectric material.
 11. A capacitor,comprising: a substantially cone-shaped first plate of conductivematerial; a layer of dielectric material formed on at least a portion ofthe first plate and substantially conforming to the shape of the firstplate; and a second plate of conductive material formed over the layerof dielectric material.
 12. A capacitor, comprising: a substantiallycone-shaped first plate of conductive material with a hollow interiorportion, wherein at least one of an interior surface and at least aportion of an exterior surface of the first plate are converted intohemispherical grains; a layer of dielectric material formed on at leasta portion of the substantially cone-shaped first plate and substantiallyconforming to the shape of the first plate and the hemispherical grains;and a second plate of conductive material formed over the layer ofdielectric material.
 13. A capacitor, comprising: a layer of formingmaterial; a first plate of conductive material formed in a predeterminedshape including an open interior portion and a closed end extendingpartially into the layer of forming material; a layer of dielectricmaterial formed on an interior surface and an exposed exterior surfaceof the first plate extending outside of the layer of forming material,wherein the layer of dielectric material substantially conforms to theshape of the first plate; and a second plate of conductive materialformed over the layer of dielectric material.
 14. A capacitor,comprising: a layer of forming material; a substantially cone-shapedfirst plate of conductive material including a vertex portion extendingpartially into the layer of forming material; a layer of dielectricmaterial formed on an interior surface and an exposed exterior surfaceof the first plate extending outside of the layer of forming material,wherein the layer of dielectric material substantially conforms to theshape of the first plate; and a second plate of conductive materialformed over the layer of dielectric material.
 15. The capacitor of claim14, wherein the layer of forming material comprises a layer ofdielectric material.
 16. The capacitor of claim 14, wherein the layer offorming material comprises a layer of oxide.
 17. A capacitor,comprising: a layer of forming material; a substantially cone-shapedfirst plate of conductive material including a vertex portion extendingpartially into the layer of forming material, wherein at least one of aninterior surface and an exterior surface of the first plate exposedoutside of the layer of forming material is converted into hemisphericalgrains; a layer of dielectric material formed on the interior surfaceand the exposed exterior surface of the first plate, wherein the layerof dielectric material substantially conforms to the shape of the firstplate and the hemispherical grains; and a second plate of conductivematerial formed over the layer of dielectric material.
 18. A capacitor,comprising: a layer of forming material; a nucleation layer formed onthe layer of forming material; a substantially cone-shaped first plateof conductive material including a vertex portion extending through thenucleation layer and partially into the layer of forming material; alayer of dielectric material formed on the nucleation layer and on aninterior surface and an exposed exterior surface of the first plateextending out of the layer of forming material and the nucleation layer,wherein the layer of dielectric material substantially conforms to theshape of the first plate; and a second plate of conductive materialformed over the layer of dielectric material.
 19. The capacitor of claim18, wherein the layer of forming material comprises a layer of dopedoxide.
 20. The capacitor of claim 18, wherein the nucleation layercomprises a layer of undoped oxide.
 21. A capacitor, comprising: a layerof forming material; a nucleation layer formed on the layer of formingmaterial; a substantially cone-shaped first plate of conductive materialincluding a vertex portion extending through the nucleation layer andpartially into the layer of forming material, wherein at least one of aninterior surface and an exposed exterior surface of the first plateextending from the layer of forming material and the nucleation layer isconverted into hemispherical grains; a layer of dielectric materialformed on the nucleation layer and on the interior surface and theexposed exterior surface of the first plate, wherein the layer ofdielectric material substantially conforms to the shape of the firstplate and the hemispherical grains; and a second plate of conductivematerial formed over the layer of dielectric material.
 22. A capacitor,comprising: a layer of forming material; an electrode formed in thelayer of forming material; a nucleation layer formed on the layer offorming material; a substantially cone-shaped first plate of conductivematerial including a vertex portion extending through the nucleationlayer and partially into the layer of forming material and in contactwith the electrode; a layer of dielectric material formed on thenucleation layer and on an interior surface and on an exposed exteriorsurface of the first plate extending out of the layer of formingmaterial and the nucleation layer, wherein the layer of dielectricmaterial substantially conforms to the shape of the first plate; and asecond plate of conductive material formed over the layer of dielectricmaterial.
 23. A capacitor, comprising: a layer of forming material; anelectrode formed in the layer of forming material; a nucleation layerformed on the layer of forming material; a substantially cone-shapedfirst plate of conductive material including a vertex portion extendingthrough the nucleation layer and partially into the layer of formingmaterial and in contact with the electrode, wherein at least one of aninterior surface and an exposed exterior surface of the first plateextending from the layer of forming material and the nucleation layer isconverted into hemispherical grains; a layer of dielectric materialformed on the nucleation layer and on the interior surface and theexposed exterior surface of the first plate, wherein the layer ofdielectric material substantially conforms to the shape of the firstplate and the hemispherical grains; and a second plate of conductivematerial formed over the layer of dielectric material.
 24. An array ofcapacitors, comprising: a plurality of first plates of conductivematerial, each formed in a predetermined shape with an open interiorportion; a layer of dielectric material formed on the plurality of firstplates and substantially conforming to the shape of each of the firstplates; and a second plate of conductive material formed over the layerof dielectric material.
 25. An array of capacitors, comprising: aplurality of substantially cone-shaped first plates of conductivematerial, wherein at least one of an interior surface and at least aportion of an exterior surface of each of the first plates are convertedinto hemispherical grains; a layer of dielectric material formed on atleast a portion of each of the plurality of first plates andsubstantially conforming to the shape of each of the first plates andthe hemispherical grains; and a second plate of conductive materialformed over the layer of dielectric material.
 26. An array ofcapacitors, comprising: a layer of forming material; a plurality ofsubstantially cone-shaped first plates of conductive material, eachincluding a vertex portion extending partially into the layer of formingmaterial; a layer of dielectric material formed on an interior surfaceand an exposed exterior portion of each of the plurality of first platesextending outside of the layer of forming material, wherein the layer ofdielectric material substantially conforms to the shape of each firstplate; and a second plate of conductive material formed over the layerof dielectric material.
 27. An array of capacitors, comprising: a layerof forming material; a plurality of substantially cone-shaped firstplates of conductive material, each including a vertex portion extendingpartially into the layer of forming material, wherein at least one of aninterior surface and an exterior surface of each first plate exposedoutside of the layer of forming material is converted into hemisphericalgrains; a layer of dielectric material formed on the interior surfaceand the exposed exterior surface of each first plate, wherein the layerof dielectric material substantially conforms to the shape of each firstplate and the hemispherical grains; and a second plate of conductivematerial formed over the layer of dielectric material.
 28. An array ofcapacitors, comprising: a layer of forming material; a nucleation layerformed on the layer of forming material; a plurality of substantiallycone-shaped first plates of conductive material, each including a vertexportion extending through the nucleation layer and partially into thelayer of forming material; a layer of dielectric material formed on thenucleation layer and on an interior surface and an exposed exteriorsurface of each first plate extending out of the layer of formingmaterial and the nucleation layer, wherein the layer of dielectricmaterial substantially conforms to the shape of each first plate; and asecond plate of conductive material formed over the layer of dielectricmaterial.
 29. A memory system, comprising: at least one memory elementincluding a capacitor, the capacitor including: a first plate ofconductive material formed in a predetermined shape, a layer ofdielectric material formed on at least a portion of the first plate andsubstantially conforming to the shape of the first plate, and a secondplate of conductive material formed over the layer of dielectricmaterial.
 30. The memory system of claim 29, wherein the first platecomprises at least one of a metal and a semiconductor material.
 31. Thememory system of claim 29, wherein the layer of dielectric materialcomprises one of a nitride layer and an oxide layer.
 32. The memorysystem of claim 29, wherein the substantially cone-shaped first platehas a substantially elliptical cross-section.
 33. A memory system,comprising: an array of memory elements, each memory element including acapacitor and each capacitor including: a substantially cone-shapedfirst plate of conductive material, a layer of dielectric materialformed on at least a portion of the first plate and substantiallyconforming to the shape of the first plate, and a second plate ofconductive material formed over the layer of dielectric material.
 34. Amemory system, comprising: an array of memory elements, each memoryelement including a capacitor and each capacitor including: asubstantially cone-shaped first plate of conductive material, wherein atleast one of an interior surface and at least a portion of an exteriorsurface of the first plate are converted into hemispherical grains, alayer of dielectric material formed on at least a portion of thesubstantially cone-shaped first plate and substantially conforming tothe shape of the first plate and the hemispherical grains, and a secondplate of conductive material formed over the layer of dielectricmaterial.
 35. A memory system, comprising: an array of memory elements,each memory element including a capacitor and each capacitor including:a layer of forming material, a substantially cone-shaped first plate ofconductive material including a vertex portion extending partially intothe layer of forming material, a layer of dielectric material formed onan interior surface and an exposed exterior portion of the first plateextending outside of the layer of forming material, wherein the layer ofdielectric material substantially conforms to the shape of the firstplate, and a second plate of conductive material formed over the layerof dielectric material.
 36. A memory system, comprising: an array ofmemory elements, each memory element including a capacitor and eachcapacitor including: a layer of forming material, a nucleation layerformed on the layer of forming material, a substantially cone-shapedfirst plate of conductive material including a vertex portion extendingthrough the nucleation layer and partially into the layer of formingmaterial, a layer of dielectric material formed on the nucleation layerand on an interior surface and an exposed exterior surface of the firstplate extending out of the layer of forming material and the nucleationlayer, wherein the layer of dielectric material substantially conformsto the shape of the first plate, and a second plate of conductivematerial formed over the layer of dielectric material.
 37. A memorysystem, comprising: an array of memory elements arranged in rows andcolumns; a plurality of address lines each coupled to one of a row or acolumn of memory elements; and a plurality of data lines each coupled toone of a row or a column of memory elements, each memory elementincluding: a transistor including a gate terminal coupled to an addressline and a source/drain terminal coupled to a data line; and a capacitorcoupled to another source/drain terminal, wherein the capacitorincludes: a layer of forming material, a nucleation layer formed on thelayer of forming material, a substantially cone-shaped first plate ofconductive material including a vertex portion extending through thenucleation layer and partially into the layer of forming material,wherein at least one of an interior surface and an exposed exteriorsurface of the first plate extending from the layer of forming materialand the nucleation layer is converted into hemispherical grains, a layerof dielectric material formed on the nucleation layer and on theinterior surface and the exposed exterior surface of the first plate,wherein the layer of dielectric material substantially conforms to theshape of the first plate and the hemispherical grains, and a secondplate of conductive material formed over the layer of dielectricmaterial.
 38. A semiconductor die, comprising: a substrate; and anintegrated circuit formed supported by the substrate, wherein theintegrated circuit comprises at least one capacitor, the at least onecapacitor including: a first plate of conductive material formed in apredetermined shape, a layer of dielectric material formed on at least aportion of the first plate and substantially conforming to the shape ofthe first plate, and a second plate of conductive material formed overthe layer of dielectric material.
 39. A semiconductor die, comprising: asubstrate; and an integrated circuit supported by the substrate, whereinthe integrated circuit comprises at least one capacitor, the at leastone capacitor including: a substantially cone-shaped first plate ofconductive material, wherein at least one of an interior surface and atleast a portion of an exterior surface of the first plate are convertedinto hemispherical grains, a layer of dielectric material formed on atleast a portion of the substantially cone-shaped first plate andsubstantially conforming to the shape of the first plate and thehemispherical grains, and a second plate of conductive material formedover the layer of dielectric material.
 40. A semiconductor die,comprising: a substrate; and an integrated circuit formed on thesubstrate, wherein the integrated circuit comprises at least onecapacitor, the at least one capacitor including: a layer of formingmaterial, a substantially cone-shaped first plate of conductive materialincluding a vertex portion extending partially into the layer of formingmaterial, a layer of dielectric material formed on an interior surfaceand an exposed exterior portion of the first plate extending outside ofthe layer of forming material, wherein the layer of dielectric materialsubstantially conforms to the shape of the first plate, and a secondplate of conductive material formed over the layer of dielectricmaterial.
 41. A semiconductor die, comprising: a substrate; and anintegrated circuit formed on the substrate, wherein the integratedcircuit comprises an array of capacitors, including: a layer of formingmaterial, a plurality of substantially cone-shaped first plates ofconductive material, each including a vertex portion extending partiallyinto the layer of forming material, wherein at least one of an interiorsurface and an exterior surface of each first plate exposed outside ofthe layer of forming material is converted into hemispherical grains, alayer of dielectric material formed on the interior surface and theexposed exterior surface of each first plate, wherein the layer ofdielectric material substantially conforms to the shape of each firstplate and the hemispherical grains, and a second plate of conductivematerial formed over the layer of dielectric material.
 42. Asemiconductor die, comprising: a substrate; and an integrated circuitformed on the substrate, wherein the integrated circuit comprises anarray of capacitors, including: a layer of forming material, anucleation layer formed on the layer of forming material, a plurality ofsubstantially cone-shaped first plates of conductive material, eachincluding a vertex portion extending through the nucleation layer andpartially into the layer of forming material, a layer of dielectricmaterial formed on the nucleation layer and on an interior surface andan exposed exterior surface of each first plate extending out of thelayer of forming material and the nucleation layer, wherein the layer ofdielectric material substantially conforms to the shape of each firstplate, and a second plate of conductive material formed over the layerof dielectric material.
 43. A semiconductor die, comprising: asubstrate; and an integrated circuit formed on the substrate, whereinthe integrated circuit comprises an array of capacitors, including: alayer of forming material, a plurality of electrodes formed in the layerof forming material, a plurality of substantially cone-shaped firstplates of conductive material, each including a vertex portion extendingpartially into the layer of forming material and each in contact with acorresponding one of the plurality of electrodes, a layer of dielectricmaterial formed on an interior surface and an exposed exterior portionof each of the plurality of first plates extending outside of the layerof forming material, wherein the layer of dielectric materialsubstantially conforms to the shape of each first plate, and a secondplate of conductive material formed over the layer of dielectricmaterial.
 44. An electronic system, comprising: a processor; and amemory system coupled to the processor, the memory system comprising anarray of memory elements and each memory element including a capacitor,each capacitor including: a first plate of conductive material formed ina predetermined shape, a layer of dielectric material formed on at leasta portion of the first plate and substantially conforming to the shapeof the first plate, and a second plate of conductive material formedover the layer of dielectric material.
 45. An electronic system,comprising: a processor; and a memory system coupled to the processor,the memory system comprising at least one memory element including acapacitor, each capacitor including: a substantially cone-shaped firstplate of conductive material, a layer of dielectric material formed onat least a portion of the first plate and substantially conforming tothe shape of the first plate, and a second plate of conductive materialformed over the layer of dielectric material.
 46. An electronic system,comprising: a processor; and a memory system coupled to the processor,the memory system comprising an array of memory elements and each memoryelement including a capacitor, each capacitor including: a substantiallycone-shaped first plate of conductive material, wherein at least one ofan interior surface and at least a portion of an exterior surface of thefirst plate are converted into hemispherical grains, a layer ofdielectric material formed on at least a portion of the substantiallycone-shaped first plate and substantially conforming to the shape of thefirst plate and the hemispherical grains, and a second plate ofconductive material formed over the layer of dielectric material.
 47. Anelectronic system, comprising: a processor; and a memory system coupledto the processor, the memory system comprising an array of memoryelements and each memory element including a capacitor, each capacitorincluding: a layer of forming material, a substantially cone-shapedfirst plate of conductive material including a vertex portion extendingpartially into the layer of forming material, a layer of dielectricmaterial formed on an interior surface and an exposed exterior portionof the first plate extending outside of the layer of forming material,wherein the layer of dielectric material substantially conforms to theshape of the first plate, and a second plate of conductive materialformed over the layer of dielectric material.
 48. An electronic system,comprising: a processor; and a memory system coupled to the processor,the memory system comprising an array of memory elements and each memoryelement including a capacitor, each capacitor including: a layer offorming material, a nucleation layer formed on the layer of formingmaterial, a substantially cone-shaped first plate of conductive materialincluding a vertex portion extending through the nucleation layer andpartially into the layer of forming material, a layer of dielectricmaterial formed on the nucleation layer and on an interior surface andan exposed exterior surface of the first plate extending out of thelayer of forming material and the nucleation layer, wherein the layer ofdielectric material substantially conforms to the shape of the firstplate, and a second plate of conductive material formed over the layerof dielectric material.
 49. An electronic system, comprising: aprocessor; and a memory system coupled to the processor, the memorysystem comprising: an array of memory elements arranged in rows andcolumns; a plurality of address lines each coupled to one of a row or acolumn of memory elements; and a plurality of data lines each coupled toone of a row or a column of memory elements, each memory elementincluding: a transistor including a gate terminal coupled to an addressline and a source/drain terminal coupled to a data line; and a capacitorcoupled to another source/drain terminal, wherein the capacitorincludes: a layer of forming material, a nucleation layer formed on thelayer of forming material, a substantially cone-shaped first plate ofconductive material including a vertex portion extending through thenucleation layer and partially into the layer of forming material,wherein at least one of an interior surface and an exposed exteriorsurface of the first plate extending from the layer of forming materialand the nucleation layer is converted into hemispherical grains, a layerof dielectric material formed on the nucleation layer and on theinterior surface and the exposed exterior surface of the first plate,wherein the layer of dielectric material substantially conforms to theshape of the first plate and the hemispherical grains, and a secondplate of conductive material formed over the layer of dielectricmaterial.
 50. An electronic system, comprising: a processor; and amemory system coupled to the processor, the memory system comprising anarray of memory elements and each memory element including a capacitor,each capacitor including: a layer of forming material, an electrodeformed in the layer of forming material, a substantially cone-shapedfirst plate of conductive material including a vertex portion extendingpartially into the layer of forming material and in contact with theelectrode, a layer of dielectric material formed on the nucleation layerand on an interior surface and on an exposed exterior surface of thefirst plate extending out of the layer of forming material and thenucleation layer, wherein the layer of dielectric material substantiallyconforms to the shape of the first plate, and a second plate ofconductive material formed over the layer of dielectric material.
 51. Amethod of making a capacitor, comprising: forming a substantiallycone-shaped first plate of conductive material; forming a layer ofdielectric material on at least a portion of the first plate andsubstantially conforming to the shape of the first plate; and forming asecond plate of conductive material over the layer of dielectricmaterial.
 52. A method of making a capacitor, comprising: forming alayer of forming material; forming at least one cavity with apredetermined shape in a surface of the layer of forming material;forming a first plate of conductive material on the layer of formingmaterial and in the at least one cavity, wherein the first plate ofconductive material forms a predetermined shape substantially conformingto the shape of the cavity with a hollow interior surface; removing thelayer of forming material to a predetermined level to expose at least aportion of an exterior surface of the first plate above a remainingportion of the layer of forming material; forming a layer of dielectricmaterial on the first plate substantially conforming to the shape of thefirst plate; and forming a second plate of conductive material over thelayer of dielectric material.
 53. The method of claim 52, whereinremoving the layer of forming material comprises: removing a portion ofthe first plate from a surface of the forming material surrounding thecavity by dry etching the first layer with an etchant that isnonreactive to the forming material.
 54. The method of claim 52, whereinremoving the layer of forming material comprises wet etching with anetchant that is non-reactive to the first plate of conductive material.55. The method of claim 52, wherein forming the layer of dielectricmaterial comprises forming a layer of one of a nitride or an oxide. 56.A method of making a capacitor, comprising: forming a first layer offorming material; forming a nucleation layer on the first layer offorming material; forming a second layer of forming material on thenucleation layer; forming at least one cavity with a predetermined shapein the first layer of forming material, the nucleation layer and thesecond layer of forming material; forming a first plate of conductivematerial on the second layer of forming material and in the at least onecavity, wherein the first layer of conductive material forms apredetermined shape substantially conforming to the shape of the cavitywith a hollow interior surface; removing the first plate of conductivematerial from the surface of the second layer of forming material aroundthe cavity; removing the second layer of forming material to expose thenucleation layer and to expose at least a portion of an exterior surfaceof the first plate of conductive material extending above of thenucleation layer; forming a layer of dielectric material on the firstplate that substantially conforms to the shape of the first plate; andforming a second plate of conductive material over the layer ofdielectric material.
 57. The method of claim 56, wherein forming thesecond layer of forming material comprises forming a layer of dopedoxide.
 58. The method of claim 56, wherein forming the nucleation layercomprises forming a layer of undoped oxide.
 59. A method of making acapacitor, comprising: forming a first layer of forming material;forming a nucleation layer on the first layer of forming material;forming a second layer of forming material on the nucleation layer;forming at least one cavity with a predetermined shape in the firstlayer of forming material, the nucleation layer and the second layer offorming material; forming a first plate of conductive material on thesecond layer of forming material and in the at least one cavity, whereinthe first layer of conductive material forms a predetermined shapesubstantially conforming to the shape of the cavity with a hollowinterior surface; removing the first plate of conductive material fromthe surface of the second layer of forming material around the cavity;removing the second layer of forming material to expose the nucleationlayer and to expose at least a portion of an exterior surface of thefirst plate of conductive material extending above of the nucleationlayer; converting at least one of an interior surface and an exteriorsurface of the first plate exposed above the nucleation layer tohemispherical grains; forming a layer of dielectric material on thefirst plate substantially conforming to the shape of the first plate andthe hemispherical grains; and forming a second plate of conductivematerial over the layer of dielectric material.
 60. A method of making acapacitor, comprising: forming a layer of forming material; forming atleast one substantially cone-shaped cavity in a surface of the layer offorming material; forming a first plate of conductive material on thelayer of forming material and in the at least one substantiallycone-shaped cavity, wherein the first layer of conductive material has asubstantially hollow cone-shape conforming to the shape of the cavity;removing the first plate of conductive material from the surface of thelayer of forming material around the cavity; removing the layer offorming material to a predetermined level to expose at least a portionof an exterior surface of the first plate; forming a layer of dielectricmaterial on the first plate substantially conforming to the shape of thefirst plate; and forming a second plate of conductive material over thelayer of dielectric material.
 61. A method of making a capacitor,comprising: forming a layer of forming material; forming at least onesubstantially cone-shaped cavity in a surface of the layer of formingmaterial; forming a isolation wall around the at least one substantiallycone-shaped cavity; forming a photo mask having a predetermined patternon the isolation wall; forming a first plate of conductive material onthe layer of forming material and in the at least one substantiallycone-shaped cavity, wherein the first plate of conductive material has asubstantially hollow cone-shape conforming to the shape of the cavity;removing the first plate of conductive material from the surface of theforming material around the cavity; removing the photo mask covering theisolation wall; removing the isolation wall; removing the layer offorming material to a predetermined level to expose at least a portionof an exterior surface of the first plate; converting at least one of aninterior surface and an exterior surface of the first plate exposedabove the layer of forming material to hemispherical grains; forming alayer of dielectric material on the first plate substantially conformingto the shape of the first plate and the hemispherical grains; andforming a second plate of conductive material over the layer ofdielectric material.
 62. A method of making an array of capacitors,comprising: forming a plurality of first plates of conductive material,each formed in a predetermined shape; forming a layer of dielectricmaterial on the plurality of first plates and substantially conformingto the shape of each of the first plates; and a second plate ofconductive material formed over the layer of dielectric material.
 63. Amethod of making an array of capacitors, comprising: forming a layer offorming material; forming a plurality of cavities in a surface of thelayer of forming material, each cavity having a predetermined shape;forming a plurality of first plates of conductive material on the layerof forming material and in each of the cavities, wherein each firstplate is formed in a predetermined shape conforming to the shape of thecavity; removing the layer of forming material to a predetermined levelto expose at least a portion of an exterior surface of each of the firstplates above a remaining portion of the layer of forming material;forming a layer of dielectric material on the first plates substantiallyconforming to the shape of the first plate; and forming a second plateof conductive material over the layer of dielectric material.
 64. Amethod of making an array of capacitors, comprising: forming a firstlayer of forming material; forming a nucleation layer on the first layerof forming material; forming a second layer of forming material on thenucleation layer; forming a plurality of cavities with a predeterminedshape in the first layer of forming material, the nucleation layer andthe second layer of forming material; forming a first plate layer ofconductive material on the second layer of forming material and in eachof the plurality of cavities, wherein the first plate layer ofconductive material forms a predetermined shape conforming to the shapeof each of the cavities with a hollow interior surface; selectivelyremoving portions of the first plate layer of conductive material fromthe surface of the second layer of forming material from around each ofthe cavities to form a plurality of first capacitor plates; removing thesecond layer of forming material using the first capacitor plates as amask to expose the nucleation layer and to expose at least a portion ofan exterior surface of each first capacitor plate extending above thenucleation layer; forming a layer of dielectric material on thenucleation layer and on each of the first capacitor plates thatsubstantially conforms to the shape of each of the first capacitorplates; and forming a second capacitor plate of conductive material overthe layer of dielectric material.
 65. A method of making an array ofcapacitors, comprising: forming a layer of forming material; forming aplurality of cone-shaped cavities in a surface of the layer of formingmaterial; forming a isolation wall around the plurality of cavities;forming a photo mask with a predetermined pattern on the isolation wall;forming a first plate layer of conductive material on the layer offorming material and in each of the substantially cone-shaped cavities,wherein the first plate layer of conductive material conformssubstantially to the shape of each of the cavities; selectively removingportions the first plate layer of conductive material from the surfaceof the forming material around each of the cavities to form a pluralityof first capacitor plates; removing the photo mask covering theisolation wall; removing the isolation wall; removing the layer offorming material to a predetermined level, using the first capacitorplates as a mask, to expose at least a portion of an exterior surface ofeach of the first capacitor plates; converting at least one of aninterior surface and an exterior surface of each of the first capacitorplates exposed above the layer of forming material to hemisphericalgrains; forming a layer of dielectric material on the layer of formingmaterial and on the first capacitor plates, wherein the dielectricmaterial substantially conforms to the shape of each of the firstcapacitor plates and the hemispherical grains; and forming a secondcapacitor plate of conductive material over the layer of dielectricmaterial.
 66. A method of making a memory system, comprising: forming anarray of memory elements; and forming a capacitor associated with eachmemory element, wherein forming each capacitor includes: forming a firstplate of conductive material formed in a predetermined shape, forming alayer of dielectric material formed on at least a portion of the firstplate and substantially conforming to the shape of the first plate, andforming a second plate of conductive material formed over the layer ofdielectric material.
 67. A method of making a memory system, comprising:forming an array of memory elements; and forming a capacitor associatedwith each memory element, wherein forming each capacitor includes:forming a first layer of forming material, forming a nucleation layer onthe first layer of forming material, forming a second layer of formingmaterial on the nucleation layer, forming at least one cavity with apredetermined shape in the first layer of forming material, thenucleation layer and the second layer of forming material, forming afirst plate of conductive material on the second layer of formingmaterial and in the at least one cavity, wherein the first layer ofconductive material forms a predetermined shape conforming to the shapeof the cavity with a hollow interior portion, removing the first plateof conductive material from the surface of the second layer of formingmaterial around the cavity, removing the second layer of formingmaterial to expose the nucleation layer and to expose at least a portionof an exterior surface of the first plate of conductive materialextending above of the nucleation layer, forming a layer of dielectricmaterial on the first plate that substantially conforms to the shape ofthe first plate, and forming a second plate of conductive material overthe layer of dielectric material.
 68. A method of making a memorysystem, comprising: forming an array of memory elements; and forming acapacitor associated with each memory element, wherein forming eachcapacitor includes: forming a layer of forming material, forming atleast one substantially cone-shaped cavity in a surface of the layer offorming material, forming a first plate of conductive material on thelayer of forming material and in the at least one substantiallycone-shaped cavity, wherein the first layer of conductive material has asubstantially hollow cone-shape conforming to the shape of the cavity,removing the first plate of conductive material from the surface of thelayer of forming material around the cavity, removing the layer offorming material to a predetermined level to expose at least a portionof an exterior surface of the first plate, forming a layer of dielectricmaterial on the first plate substantially conforming to the shape of thefirst plate, and forming a second plate of conductive material over thelayer of dielectric material.
 69. A method of making a memory system,comprising: forming an array of memory elements arranged in rows andcolumns; forming a plurality of address lines each coupled to one of arow or a column of memory elements; and forming a plurality of datalines each coupled to one of a row or a column of memory elements,wherein forming each memory element includes: forming a transistorincluding a gate terminal coupled to one of the plurality of addresslines and a source/drain terminal coupled to one of the plurality ofdata lines; and forming a capacitor coupled to another source/drainterminal of the transistor, wherein forming the capacitor includes:forming a layer of forming material, forming a nucleation layer formedon the layer of forming material, forming a substantially cone-shapedfirst plate of conductive material including a vertex portion extendingthrough the nucleation layer and partially into the layer of formingmaterial, wherein at least one of an interior surface and an exposedexterior surface of the first plate extending from the layer of formingmaterial and the nucleation layer is converted into hemisphericalgrains, forming a layer of dielectric material formed on the nucleationlayer and on the interior surface and the exposed exterior surface ofthe first plate, wherein the layer of dielectric material substantiallyconforms to the shape of the first plate and the hemispherical grains,and forming a second plate of conductive material formed over the layerof dielectric material.
 70. A method of making a semiconductor die,comprising: providing a substrate; forming an integrated circuitsupported by the substrate; and forming a capacitor associated with theintegrated circuit, wherein forming the capacitor includes: forming afirst plate of conductive material formed in a predetermined shape,forming a layer of dielectric material formed on at least a portion ofthe first plate and substantially conforming to the shape of the firstplate, and forming a second plate of conductive material formed over thelayer of dielectric material.
 71. A method of making a semiconductordie, comprising: providing a substrate; forming an integrated circuitsupported by the substrate; and forming a capacitor associated with theintegrated circuit, wherein forming the capacitor includes: forming afirst layer of forming material; forming a nucleation layer on the firstlayer of forming material; forming a second layer of forming material onthe nucleation layer; forming at least one cavity with a predeterminedshape in the first layer of forming material, the nucleation layer andthe second layer of forming material; forming a first plate ofconductive material on the second layer of forming material and in theat least one cavity, wherein the first layer of conductive materialforms a predetermined shape conforming to the shape of the cavity with ahollow interior surface; removing the first plate of conductive materialfrom the surface of the second layer of forming material around thecavity; removing the second layer of forming material to expose thenucleation layer and to expose at least a portion of an exterior surfaceof the first plate of conductive material extending above of thenucleation layer; forming a layer of dielectric material on the firstplate that substantially conforms to the shape of the first plate; andforming a second plate of conductive material over the layer ofdielectric material.
 72. A method of making a semiconductor die,comprising: providing a substrate; forming an integrated circuitsupported by the substrate; and forming a capacitor associated with theintegrated circuit, wherein forming the capacitor includes: forming alayer of forming material; forming at least one substantiallycone-shaped cavity in a surface of the layer of forming material;forming a first plate of conductive material on the layer of formingmaterial and in the at least one substantially cone-shaped cavity,wherein the first layer of conductive material has a substantiallyhollow cone-shape conforming to the shape of the cavity; removing thefirst plate of conductive material from the surface of the layer offorming material around the cavity; removing the layer of formingmaterial to a predetermined level to expose at least a portion of anexterior surface of the first plate; converting at least one of aninterior surface and an exterior surface of each of the first platesexposed above the layer of forming material to hemispherical grains;forming a layer of dielectric material on the first plate substantiallyconforming to the shape of the first plate and the hemispherical grains;and forming a second plate of conductive material over the layer ofdielectric material.
 73. A method of making an electronic system,comprising: forming a processor; and forming a memory system coupled tothe processor and including a plurality of memory cells, wherein formingthe memory system includes forming a capacitor associated with eachmemory cell of the memory system and wherein forming each capacitorincludes: forming a first plate of conductive material formed in apredetermined shape, forming a layer of dielectric material formed on atleast a portion of the first plate and substantially conforming to theshape of the first plate, and forming a second plate of conductivematerial formed over the layer of dielectric material.
 74. A method ofmaking an electronic system, comprising: forming a processor; andforming a memory system coupled to the processor and including aplurality of memory cells, wherein forming the memory system includesforming a capacitor associated with each memory cell of the memorysystem and wherein forming each capacitor includes: forming a firstlayer of forming material; forming a nucleation layer on the first layerof forming material; forming a second layer of forming material on thenucleation layer; forming at least one cavity with a predetermined shapein the first layer of forming material, the nucleation layer and thesecond layer of forming material; forming a first plate of conductivematerial on the second layer of forming material and in the at least onecavity, wherein the first layer of conductive material forms apredetermined shape conforming to the shape of the cavity with a hollowinterior surface; removing the first plate of conductive material fromthe surface of the second layer of forming material around the cavity;removing the second layer of forming material to expose the nucleationlayer and to expose at least a portion of an exterior surface of thefirst plate of conductive material extending above of the nucleationlayer; forming a layer of dielectric material on the first plate thatsubstantially conforms to the shape of the first plate; and forming asecond plate of conductive material over the layer of dielectricmaterial.
 75. A method of making an electronic system, comprising:forming a processor; and forming a memory system coupled to theprocessor and including a plurality of memory cells, wherein forming thememory system includes forming a capacitor associated with each memorycell of the memory system and wherein forming each capacitor includes:forming a layer of forming material; forming at least one substantiallycone-shaped cavity in a surface of the layer of forming material;forming a first plate of conductive material on the layer of formingmaterial and in the at least one substantially cone-shaped cavity,wherein the first layer of conductive material has a substantiallyhollow cone-shape conforming to the shape of the cavity; removing thefirst plate of conductive material from the surface of the layer offorming material around the cavity; removing the layer of formingmaterial to a predetermined level to expose at least a portion of anexterior surface of the first plate; converting at least one of aninterior surface and an exterior surface of each of the first capacitorplates exposed above the layer of forming material to hemisphericalgrains; forming a layer of dielectric material on the first platesubstantially conforming to the shape of the first plate and thehemispherical grains; and forming a second plate of conductive materialover the layer of dielectric material.